The first problem is that the electronics are not resistant to pressure. This is currently solved by housing the electronics in thick metal hulls which keeps the pressure inside the hull low. However, the pressure in the deep sea is hundreds of times greater than the pressure inside on these air filled hulls. This pressure difference creates a large force on these hulls which requires them to be bulky and thick. Instead we design our electronics to be pressure tolerant and fill the hull with non-conductive fluids to minimise compression and keep the pressure difference low while still protecting the electronics from the seawater. This averts these forces and allows for a thin, light and inexpensive hull.